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Semiconductor assembly and processing - List of Manufacturers, Suppliers, Companies and Products

Semiconductor assembly and processing Product List

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"Semiconductor assembly and processing outsourcing" Daisoto

"Semiconductor assembly and processing outsourcing" Daisoto

In the state of the sheet after dicing, it cannot be picked up by the device, and we want to change to tray specifications; we can accommodate even just with die sorting according to the application!

The equipment is not compatible with the sheet state after dicing, making it impossible to pick up. We would like to change to tray specifications to use the necessary chips according to the production quantity. We can accept requests for die sorting only, tailored to your needs. We have sufficient mass production experience even with chip sizes under 1mm, so please feel free to contact us for inquiries or quotes. 【Overview】 ■ Wafer (Max 8 inches) ■ 2-inch, 3-inch trays *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer

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Introduction of Hakodate Electronics' technology: "Au Stud Bump Processing"

Introduction of Hakodate Electronics' technology: "Au Stud Bump Processing"

Capable of handling small-scale processing. Reduces implementation area and contributes to product miniaturization. Accurate, quick, and reasonable.

Our company has a proven track record in semiconductor manufacturing and is engaged in assembly processing of semiconductors, including 'Au stud bump processing,' based on the technology cultivated through integrated circuit manufacturing. We have established a processing system that is accurate, high-quality, speedy, and reasonably priced, allowing us to accommodate small quantities after determining conditions tailored to specifications and applications. 【Features】 ■ The mounting area can be minimized, enabling product miniaturization. ■ Processing of extremely small diameters of 25μm is possible. ■ Fine processing with a bump pitch of 28μm is achievable. *We are currently offering materials that introduce the mechanism of bump processing. Please check it out from "PDF Download." Feel free to contact us as well.

  • Processing Contract

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[Contract Assembly and Processing of Semiconductors] Au Stud Bump

[Contract Assembly and Processing of Semiconductors] Au Stud Bump

Supports stud bump bonding processing that can reduce the implementation area! We also have a track record of delivering bump diameters of 30μm for small diameters!

The bump shapes can be customized according to requirements, including pull cut, leveling, tamping, and multi-stage bumps. The wafer size can accommodate up to 8 inches. We can handle a wide range of processing, from mass production to small-batch prototypes and individual chip processing. Please feel free to contact us for inquiries or quotes regarding processing. 【Overview】 ■ Si, quartz, GaAs ■ Wafer size (Max 8 inches) ■ Bump size (Min 30μm) *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductors

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